| Press Release
US Patent Office - Delays In Getting Technology Protection
Mequon, WI, January 4, 2010 - Telaric Ideas releases its annual tabulation of the time it takes to get a patent.
Patents in 2009 taking the longest time to be approved for the state of Id.
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7510961 | Patent Date: | Mar. 31, 2009
| 12.1 Years to be approved |
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Title: | Utilization of energy absorbing layer to improve metal flow and fill in a novel interconnect structure
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| Inventor(s): |
John H. Givens, Meridian, Id. (US)
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| Assignee: | Micron Technology, Inc., Boise, Id. (US)
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7485587 | Patent Date: | Feb. 03, 2009
| 11.1 Years to be approved |
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Title: | Method of making a semiconductor device having improved contacts
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| Inventor(s): |
Howard E. Rhodes, Boise, Id. (US)
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| Assignee: | Micron Technology, Inc., Boise, Id. (US)
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7592898 | Patent Date: | Sep. 22, 2009
| 10.5 Years to be approved |
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Title: | Wireless communication systems, interrogators and methods of communicating within a wireless communication system
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| Inventor(s): |
David K. Ovard, Meridian, Id. (US); and Roy Greeff, Boise, Id. (US)
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| Assignee: | Keystone Technology Solutions, LLC, Boise, Id. (US)
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7552090 | Patent Date: | Jun. 23, 2009
| 9.9 Years to be approved |
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Title: | Method for billing for services delivered over a computer network
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| Inventor(s): |
Timothy P. Barber, San Diego, Calif. (US)
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| Assignee: | Keynetics Inc., Boise, Id. (US)
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7635079 | Patent Date: | Dec. 22, 2009
| 9.6 Years to be approved |
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Title: | System for locating conductive sphere utilizing screen and hopper of solder balls
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| Inventor(s): |
Chad A. Cobbley, Boise, Id. (US); Michael B. Ball, Boise, Id. (US); and Marjorie L. Waddel, Boise, Id. (US)
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| Assignee: | Micron Technology, Inc., Boise, Id. (US)
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7580887 | Patent Date: | Aug. 25, 2009
| 9.3 Years to be approved |
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Title: | Method and apparatus for facilitating purchase transactions across a network
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| Inventor(s): |
John E. Geering, Nampa, Id. (US)
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| Assignee: | Micron Technology, Inc., Boise, Id. (US)
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7576400 | Patent Date: | Aug. 18, 2009
| 9.3 Years to be approved |
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Title: | Circuitry and gate stacks
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| Inventor(s): |
Zhiping Yin, Boise, Id. (US); Ravi Iyer, Boise, Id. (US); Thomas R. Glass, Idaho City, Id. (US); Richard Holscher, Boise, Id. (US); Ardavan Niroomand, Boise, Id. (US); Linda K. Somerville, Boise, Id. (US); and Gurtej S. Sandhu, Boise, Id. (US)
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| Assignee: | Micron Technology, Inc., Boise, Id. (US)
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7530877 | Patent Date: | 5/12/2009
| 9.2 Years to be approved |
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Title: | Semiconductor processor systems, a system configured to provide a semiconductor workpiece process fluid
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| Inventor(s): |
Scott E. Moore, Meridian, Id. (US); Scott G. Meikle, Gainesville, Va. (US); and Magdel Crum, Portland, Oreg. (US)
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| Assignee: | Micron Technology, Inc., Boise, Id. (US)
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7547579 | Patent Date: | Jun. 16, 2009
| 9.2 Years to be approved |
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Title: | Underfill process
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| Inventor(s): |
Tongbi Jiang, Boise, Id. (US)
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| Assignee: | Micron Technology, Inc., Boise, Id. (US)
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7557452 | Patent Date: | Jul. 07, 2009
| 9.1 Years to be approved |
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Title: | Reinforced, self-aligning conductive structures for semiconductor device components and methods for fabricating same
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| Inventor(s): |
Vernon M. Williams, Meridian, Id. (US); Ford B. Grigg, Meridian, Id. (US); and Bret K. Street, Meridian, Id. (US)
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| Assignee: | Micron Technology, Inc., Boise, Id. (US)
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7492086 | Patent Date: | Feb. 17, 2009
| 9.1 Years to be approved |
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Title: | Low work function emitters and method for production of FED's
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| Inventor(s): |
David A. Cathey, Boise, Id. (US); Surjit S. Chadha, Meridian, Id. (US); and Behnam Moradi, Boise, Id. (US)
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| Assignee: | Micron Technology, Inc., Boise, Id. (US)
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7560815 | Patent Date: | Jul. 14, 2009
| 9.1 Years to be approved |
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Title: | Device structures including ruthenium silicide diffusion barrier layers
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| Inventor(s): |
Brian A. Vaartstra, Nampa, Id. (US); and Eugene P. Marsh, Boise, Id. (US)
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| Assignee: | Micron Technology, Inc., Boise, Id. (US)
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7605934 | Patent Date: | Oct. 20, 2009
| 8.5 Years to be approved |
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Title: | Method and system for facsimile delivery using dial-up modem pools
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| Inventor(s): |
Doug Rollins, Nampa, Id. (US)
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| Assignee: | Micron Technology, Inc., Boise, Id. (US)
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7570504 | Patent Date: | Aug. 04, 2009
| 8.4 Years to be approved |
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Title: | Device and method to reduce wordline RC time constant in semiconductor memory devices
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| Inventor(s): |
Huy Thanh Vo, Boise, Id. (US)
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| Assignee: | Micron Technology, Inc., Boise, Id. (US)
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7489790 | Patent Date: | Feb. 10, 2009
| 8.2 Years to be approved |
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Title: | Digital automatic gain control
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| Inventor(s): |
Jon Schmidt Kindred, Minneapolis, Minn. (US); Bryant Sorensen, Colorado Springs, Colo. (US); and Jerry Wahl, Woodland Park, Colo. (US)
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| Assignee: | AMI Semiconductor, Inc., Pocatello, Id. (US)
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7526795 | Patent Date: | Apr. 28, 2009
| 8.1 Years to be approved |
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Title: | Data security for digital data storage
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| Inventor(s): |
Doug L. Rollins, Nampa, Id. (US)
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| Assignee: | Micron Technology, Inc., Boise, Id. (US)
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7629630 | Patent Date: | Dec. 08, 2009
| 8.1 Years to be approved |
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Title: | Electropolished patterned metal layer for semiconductor devices
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| Inventor(s): |
Richard H. Lane, Boise, Id. (US)
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| Assignee: | Micron Technology, Inc., Boise, Id. (US)
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7631170 | Patent Date: | Dec. 08, 2009
| 7.8 Years to be approved |
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Title: | Program controlled embedded-DRAM-DSP having improved instruction set architecture
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| Inventor(s): |
Eric M. Dowling, Richardson, Tex. (US)
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| Assignee: | Micron Technology, Inc., Boise, Id. (US)
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7549011 | Patent Date: | Jun. 16, 2009
| 7.8 Years to be approved |
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Title: | Bit inversion in memory devices
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| Inventor(s): |
Anthony Moschopoulos, San Jose, Calif. (US)
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| Assignee: | Micron Technology, Inc., Boise, Id. (US)
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7518223 | Patent Date: | Apr. 14, 2009
| 7.6 Years to be approved |
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Title: | Semiconductor devices and semiconductor device assemblies including a nonconfluent spacer layer
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| Inventor(s): |
James M. Derderian, Boise, Id. (US)
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| Assignee: | Micron Technology, Inc., Boise, Id. (US)
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7558390 | Patent Date: | Jul. 07, 2009
| 7.6 Years to be approved |
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Title: | Listening device
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| Inventor(s): |
Jakob Nielsen, Waterloo (Canada); Robert Brennan, Kitchener (Canada); and Todd Schneider, Waterloo (Canada)
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| Assignee: | AMI Semiconductor, Inc., Pocatello, Id. (US)
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7477556 | Patent Date: | Jan. 13, 2009
| 7.5 Years to be approved |
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Title: | 256 Meg dynamic random access memory
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| Inventor(s): |
Brent Keeth, Boise, Id. (US); Layne G. Bunker, Boise, Id. (US); Raymond J. Beffa, Boise, Id. (US); and Frank F. Ross, Boise, Id. (US)
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| Assignee: | Micron Technology, Inc., Boise, Id. (US)
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7497005 | Patent Date: | Mar. 03, 2009
| 7.5 Years to be approved |
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Title: | Method for forming an inductor
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| Inventor(s): |
Leonard Forbes, Corvallis, Oreg. (US); and Kie Y. Ahn, Chappaqua, N.Y. (US)
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| Assignee: | Micron Technology, Inc., Boise, Id. (US)
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7589029 | Patent Date: | Sep. 15, 2009
| 7.4 Years to be approved |
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Title: | Atomic layer deposition and conversion
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| Inventor(s): |
Garo J. Derderian, Boise, Id. (US); and Gurtej Singh Sandhu, Boise, Id. (US)
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| Assignee: | Micron Technology, Inc., Boise, Id. (US)
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7634624 | Patent Date: | Dec. 15, 2009
| 7.2 Years to be approved |
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Title: | Memory system for data storage and retrieval
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| Inventor(s): |
Sergey Anatolievich Gorobets, Edinburgh (United Kingdom)
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| Assignee: | Micron Technology, Inc., Boise, Id. (US)
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